India to build first 3D glass chip packaging plant

India is set to begin construction of its first advanced 3D glass semiconductor packaging unit in Bhubaneswar, Odisha, on April 19, 2026. The facility, backed by Intel, represents a major technological leap into next-generation chip packaging, which is critical for AI, defense, and high-performance computing. With an investment of over ₹1,900 crore, the project aims to position Odisha as a global semiconductor hub and marks a strategic shift for India from a chip importer to a cutting-edge innovator.